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PCB electroplating process , about possible Category: Acid bright copper plating, electroless nickel / gold , tin plating , the article describes the process on the circuit board , the plating process technologies and processes, as well as specific methods of operation . Two . Process: Pickling → ??full board plating copper pattern transfer → → → two countercurrent rinsing acidic degreasing → ??→ two countercurrent rinsing microetching pickling → ??→ → two countercurrent rinse tinned countercurrent rinsing → ??pickling → ??→ → two graphics plated copper Nickel -plated stage countercurrent rinsing → ??washing → → two gilded dip citrate → → recycling → ??2-3 grade pure water washing → drying Three . Process Description : ( A ) pickle C. The bath is transferred to the standby tank , add 1-3ml / 30% hydrogen peroxide of L , start heating until the temperature is about 65 degrees to the air added with stirring , stirred for 2-4 hours heat the air D. switched off air stirring at 3 5 g / l of active carbon will slowly dissolve into the bath , until thoroughly dissolved , stirring open air , so incubated for 2 4 hours ?? E. Turn off the air mixing , heating , so that the activated carbon flour slowly settling to the bottom F. until the temperature dropped about 40 degrees , with 10um filtered bath of PP filter plus filter aid powder to clean the work tank , open air mixing, into the anode , linked into the electrolytic plates press 0 2-0 5ASD current density and low current electrolysis 6 8 hours , G. through laboratory analysis , adjusting tank of sulfuric acid , copper sulfate, chloride ion content to within the normal operating range .. ? according to the Hall cell test results supplement light agent H. pending electrolytic plate board surface color evenly, you can stop electrolysis, and then press the 1-1 5ASD current density electrolysis raw film treatment for 1-2 hours , until the anode to generate a dense layer of uniform good adhesion . black phosphorus film can I. plated OK to try . ⑤ copper balls contained in the anode 3 0 0 6 % of phosphorus , the main purpose is to reduce the efficiency of the anodic dissolution to reduce the generation of copper . ? . ⑥ supplementary medicines, such as adding a large amount of copper sulfate, sulfuric acid should look after adding low-current electrolysis additional sulfuric acid should pay attention to safety , a large amount of additional time (10 liters ) should slow up several times plus otherwise it will create the bath temperature , light stabilizers accelerate decomposition , contamination bath Special attention should be ⑦ additional chloride ions , particularly low because the chloride ion content (30-90ppm), be sure to use when adding additional cylinder or measuring cup after weighing accuracy 1ml hydrochloric acid, chlorine ions about 385ppm, ⑧ drugs add formula: Copper ( unit: kg ) = (75-X) × tank volume ( L ) / 1000 Sulfuric acid ( Unit : L ) = (10%-X) g / L × tank volume ( liters ) Or ( Unit: L ) = (180-X) g / L × tank volume ( liters ) / 1840 Hydrochloric acid ( unit : ml) = (60-X) ppm × tank volume ( liters ) / 385 (C ) acidic degreasing ① purpose and effect : to remove the surface oxide copper lines , ink plastic film over glue , binding force guarantee a copper or nickel plated copper and graphics between ② Remember acidic degreaser used here , why not use alkaline degreasers and degreasing effect of alkaline degreasers better than the acidic degreaser ? Mainly because the graphics are not alkali ink will damage the graphic line , it can only be used before the pattern plating acidic degreaser . ③ only control the production concentration and time to degreasers , degreasers concentration of about 10% , the time to ensure that in six minutes , a little longer will not have an adverse effect bath replacement is in accordance with the use of 15 square meters / liter Work liquid supplement add 100 square meters according to 0 5 0 8L.?. (D ) microetch : ① purpose and effect : clean copper surface roughening line , make sure the graphics plating adhesion between copper and a copper ② micro- corrosion agent to use more sodium persulfate , coarsening rate steady uniform washing is good, the general control over the sodium concentration of 60 g / l or so , the time control in about 20 seconds , pharmaceuticals add 3-4 kg at 100 meters copper content control at 20 g / liter other maintenance are changing with heavy copper cylinder microetching . |
